New Delhi: Intel Corporation and 3D Glass Solutions (3DGS) have signed a Memorandum of Understanding (MoU) to explore the establishment of a world-class advanced semiconductor glass core packaging substrate manufacturing facility in Odisha, the state government has announced.
The proposed project—which is subject to necessary approvals, funding support from the state and central governments, and other business and regulatory conditions—represents a transformative opportunity for Odisha’s technology landscape.
If realised, it would be among the most significant technology investments in Eastern India, and would position Odisha as an emerging global hub for semiconductor manufacturing, advanced packaging, AI infrastructure, next-generation data centres, and digital technologies.
The Odisha government has invited ecosystem partners, technology leaders, research institutions, and industry stakeholders from across the world to participate in building one of Asia’s most advanced semiconductor and digital infrastructure ecosystems.
Odisha Chief Secretary Anu Garg said that the MoU marks a “transformative step in Odisha’s journey towards becoming a key player in advanced semiconductor and electronics manufacturing”.
“With strong policy support, skilled talent, and integrated infrastructure, Odisha is ready to contribute meaningfully to India’s semiconductor ambitions,” she said.
Chief Minister Mohan Charan Majhi called the initiative a “new chapter in Odisha’s growth story”.
“Our vision is to build a vibrant ecosystem that inspires future generations, creates world-class opportunities for our youth, attracts leading global technology companies, and firmly places Odisha on the global semiconductor map. This is a transformational, generational opportunity that will accelerate economic growth, strengthen India’s technological self-reliance, and position Odisha at the forefront of the global digital economy,” his statement read.
Dr Mukesh Mahaling, Odisha’s Minister of Electronics and Information Technology, also said that the state remains focused on building a conducive ecosystem that promotes innovation, facilitates investments, creates job opportunities, and drives inclusive growth across industries.
In a statement, Babu Mandava, CEO of 3D Glass Solutions, said, “This initiative has the potential to establish India as a key global hub for advanced glass substrates and semiconductor packaging, supporting high-growth sectors such as artificial intelligence, high-performance computing, and next-generation electronics.”
Meanwhile, Naga Chandrasekaran, Executive Vice President and General Manager at Intel Foundry said that as a pioneer in glass core substrate technology, Intel is “excited about the potential of this collaboration to accelerate the commercialization of next-generation advanced packaging solutions globally”.
Union Minister for Electronics and Information Technology Ashwini Vaishnaw remarked that the initiative reflects India’s “larger vision of strengthening domestic manufacturing capabilities and positioning the country as a global economic powerhouse”.
Aligned with Odisha government’s ‘Vision 2036’ and Centre’s vision of ‘Atmanirbhar Bharat’, this initiative is aimed at reinforces the state’s commitment to developing a globally competitive semiconductor, electronics, AI, and digital infrastructure ecosystem that will serve both national priorities and global markets in the decades ahead.
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