(Reuters) – Dutch chipmaking parts supplier BE Semiconductor Industries (Besi) beat expectations for second-quarter new orders on Thursday, as demand for its hybrid bonding tools, photonics and 2.5D assembly solutions for AI applications partially offset weak automotive end markets.
The chip assembly equipment maker’s new order bookings rose to 185.2 million euros ($200.74 million) in the three months to the end of June, compared with analysts’ consensus of 179 million euros compiled by Visible Alpha and cited by ING analysts.
That compares to orders of 128 million euros booked in the first three months of 2024.
($1 = 0.9226 euros)
(Reporting by Dagmarah Mackos, Editing by Christian Schmollinger)
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