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Thursday, January 30, 2025
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HomeTechUS announces $1.4 billion support for next-generation semiconductor advanced packaging

US announces $1.4 billion support for next-generation semiconductor advanced packaging

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(Reuters) – The U.S. Department of Commerce on Thursday announced $1.4 billion in final awards to support the next generation of semiconductor advanced packaging.

(Reporting by Devika Nair in Bengaluru; editing by Jason Neely)

Disclaimer: This report is auto generated from the Reuters news service. ThePrint holds no responsibility for its content.

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