By Arsheeya Bajwa and Joyce Lee
(Reuters) -South Korean chipmaker SK Hynix, an Nvidia supplier, is planning to invest roughly $4 billion to build an advanced chip packaging facility in West Lafayette, Indiana, the Wall Street Journal reported on Tuesday.
Operations at the facility could begin in 2028, the report said, citing people familiar with the matter.
SK Hynix is reviewing its plans to set up an advanced chip packaging investment in the U.S., but has yet to decide, it said in a statement.
The facility is expected to add 800 to 1,000 new jobs, according to the report.
SK pledged in 2022 to invest $15 billion in the semiconductor industry through research and development programs, materials, and the creation of an advanced packaging and testing facility in the United States.
This month, the world’s second-largest memory chipmaker began mass production of next-generation high-bandwidth memory (HBM) chips used in artificial intelligence chipsets, with sources saying initial shipments will go to Nvidia.
SK Hynix has been the sole supplier of the version currently used – the HBM3 – to Nvidia which has 80% of the market for AI chips.
(Reporting by Arsheeya Bajwa in Bengaluru and Joyce Lee in Seoul; Editing by Sonia Cheema, Sohini Goswami and Louise Heavens)
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