(Reuters) – Amkor Technology said Thursday it will spend $2 billion to build a new advanced semiconductor packaging and test facility in Arizona that will package and test chips for Apple produced at a nearby TSMC facility.
Amkor will provide advanced packaging and testing of semiconductors to support high-performance computing, automotive, and communications. Amkor said when the new facility opens, Apple will be its first and largest customer. Apple separately confirmed its expanded partnership with Amkor.
(Reporting by David Shepardson)
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